Laser direct structuring (LDS) is a special success story. For almost 20 years, it has been possible to apply electronic conductor paths directly onto plastic parts during series production. LDS enables the production of electronic assemblies with flexible geometric shapes. This process enables electronic products (such as smart phones, sensors or medical devices) to become even smaller and more powerful. Automated manufacturing processes also make this process more economically attractive.
There is less and less space available for electronic assemblies, so solutions are needed which replace conventional printed circuit boards. LDS enables further miniaturization and makes increasingly complex geometric designs possible. This is a stable and reliable process that has established itself in quality-critical sectors such as medical technology or safety-relevant components for the automotive industry.
LDS process enables three-dimensional assemblies
Direct laser structuring enables 3D-MID (Mechatronic Integrated Devices) assemblies to be produced. When using 3D-MID, electronic components can be
